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High Temperature Elongation Electrodeposited copper foil for PCB as per IPC 4562

  • High Temperature Elongation Electrodeposited copper foil for PCB as per IPC 4562
  • High Temperature Elongation Electrodeposited copper foil for PCB as per IPC 4562
  • High Temperature Elongation Electrodeposited copper foil for PCB as per IPC 4562
  • High Temperature Elongation Electrodeposited copper foil for PCB as per IPC 4562
  • High Temperature Elongation Electrodeposited copper foil for PCB as per IPC 4562
Model No.︰HTE
Brand Name︰Canhu/OEM
Country of Origin︰China
Unit Price︰US $ 13 / kg
Minimum Order︰100 kg
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Product Description
S-HTE ED Copper Foil for PCB          
                 
Specification:               
Thickness:1/4OZ~2OZ(9μm~70μm)          
Width: 550mm~1295mm(For normal PCB)          
                 
Performance              
Classification Unit 1/4OZ (9μm) 1/3OZ (12μm) J OZ  (15μm) 1/2OZ (18μm) 1OZ   (35μm) 2OZ  (70μm)
Cu Content % ≥99.8
Area weight g/m2 80±3 107±3 127±4 153±5 283±5 585±10
Tensile Strength R.T.(25℃) Kg/mm2 ≥28 ≥30
H.T.(180℃) ≥15
Elongation R.T.(25℃) % ≥4.0 ≥5.0 ≥6.0 ≥10
H.T.(180℃) ≥4.0 ≥5.0 ≥6.0
Roungness Shiny(Ra) μm ≤0.4
Matte(Rz) ≤5.0 ≤6.0 ≤7.0 ≤7.0 ≤9.0 ≤14
Peel Strength R.T.(23℃) Kg/cm ≥1.0 ≥1.2 ≥1.2 ≥1.3 ≥1.8 ≥2.0
Degraded rate of HCФ(18%-1hr/25℃) % ≤5.0
Change of color(E-1.0hr/190℃) % Good
Solder Floating 290℃ Sec. ≥20
Pinhole EA None
Preperg / FR-4
Payment Terms︰T/T, L/C
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